瀚軒股份有限公司 - Hypersonic Inc Company - 自動化設備

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Wafer Skeleton Inspection System

WS-100
	Auto load / unload To compare real image and map data To find out Good Bin remain To find out Fail Bin disappear Small die analysis algorithm Min Die size :0.5 x 0.5 mm UPH : 30~48 ea depend on die size 8" ⬌ 12" by change kit within 5 min