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Wafer Skeleton Inspection System

WS-100
  • Auto load / unload
  • To compare real image and map data
  • To find out Good Bin remain 
  • To find out Fail Bin disappear
  • Small die analysis algorithm
  • Min Die size :0.5 x 0.5 mm
  • UPH : 30~48 ea depend on die size
  • 8" ⬌ 12" by change kit within 5 min
No. 209, Sec. 2, Junghua Rd., Jungli City, Taoyuan, Taiwan 32068
Tel：+886-3-461-1902 　Fax：+886-3-452-4128
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