Action series gravity handler provide a simple/robust & efficiency/economy handling system for SOP family package in testing. A small footprint machine with short plunger or long plunger option, multi-test site, low jam rate /High UPH and flexible operation interface. Action series provide own socket(Kelvin & non-kelvin), but also compatible for 3rd party socket.

A speedy driver IC sorter equipped with 6 waffle-tray bins, and optional back-side inspection function.

To scan skeleton die images and analysis / compare to original map file , the process is after die-bond.

Multiple substrates stencil printing application with precisely fiducial mark alignment, auto print with motor squeegee, auto clean for stencil and strips auto load/unload. The system provide robust printing quality and high throughput.

A full-auto load/unload contact angle measuring system. To provide auto droplet control, auto dispensing and contact angle auto measuring. The droplet dispensing position is also programmable. For the option, HPC provide semi-auto and manual system for contact angle measuring.

After final testing. To re-fill the non-full tray. To have simple AOI. To have tray exchange for necessary.

To provide an simple and manual inspection environment for Die-bonding & wire-bonding products , the system provide convenient functions for hand-free, easy operation, easy change kit and web-service. Also to avoid the products be damaged and improve the inspection method and speed.

Load & unload system with AGV/OHT for Musashi dispenser.

To measure the fillet height thickness and the percentage with 5M pixel CCD and Optical ruler, data could be uploaded.It could improve current measure way and speed up the calculation with data upload.

To read the 1D/2D barcode on dies in wafer.

To measure the wafer thickness & roughness.

To clean the object by ACP Snow Jet LCO2 system. Customized equipment.