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Die Sorting System

HDS-200
  • Auto wafer sorter system
  • Top side / Back side Optical Inspection
  • Wafer to Tray
  • Tray Output : Auto bin  x 6
  • Tray Size : 2”、 3”、 4” Waffle Tray
  • In-pocket inspection
  • UPH : 6000 ± 10%
  • Jam rate : 1/5000
  • Position Accuracy : ± 40μm & Angle ± 1.5° @3σ
  • Die size : 1x1 ~ 35x18 mm, Thickness ≧ 100 μm 
No. 209, Sec. 2, Junghua Rd., Jungli City, Taoyuan, Taiwan 32068
Tel：+886-3-461-1902 　Fax：+886-3-452-4128
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