Hypersonic Inc. will participate in the Taiwan Semiconductor Exhibition from September 4 to September 6, 2024, showcasing its latest agency-packaged testing equipment and materials and engaging in face-to-face discussions with several semiconductor manufacturers.
The exhibition attracts leading companies and professionals from around the world. Hypersonic will display areas featuring the latest technology, including semiconductor packaging testing equipment, automated production solutions, and advanced material applications. Visitors will have the opportunity to experience these technologies firsthand and understand their advantages in improving production efficiency and product quality
We welcome everyone to visit Hypersonic Inc.'s booth at the Taiwan Semiconductor Exhibition from September 4 to September 6, 2024, and witness the limitless possibilities of technology.
About Hypersonic Inc.
Hypersonic Inc. specializes in the agency of semiconductor packaging testing equipment and materials, committed to providing efficient and reliable solutions to support the sustainable development of the global semiconductor industry.