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Products
IC Packaging
IC Testing
Automation
Products
Die Sorting System(HDS-200)
Die Sorting System(HDS-200)
HDS-200
Features:
Support 8”/12” Frame wafer
Output waffle tray 2”/3”/4”tray
Output 6 bins maximum
HDS-200 running cycle time≦0.56s
HDS-200 UPH≧ 6K
Tray P/N confirm
Backside inspection(Option)
P&Pclean platform
Easy change kit
Dimension1.5m(W) x 1.5m(L) x 2m(H)
Clean room class 100 (HEPA)
Vision inspection:
Surface and sawing lane
foreign material/ chiping
scratch / crack
Resolution
15μm / NG size; 1 pixel = 3μm
Basic Functions:
Wafer auto loading/unloading
Wafer tape expending(10 mm Maximum)
Mapping data confirm
Die transportation
8”/12” wafer switch
Die backside inspection(Option)
Outputtray In-pocket inspection
Output tray 2x3
Tray stack 2x3
Empty tray auto load
Ionizer
HEPA
Specification
UPH
6.0K ±10% (No backside inspection)
Cycle time
0.56 sec(maximum)
Wafer size
8”, 12”
Walffle Tray size
2”, 3”, 4”
Category/bins
6 (=2x3)
Die size range
1x1 ~ 35x18 mm
Place accuracy
±40μm
Backside resolution
15μm / NG size
Vacuum cup change time
< 3 min
Needle change time
< 5 min
Wafer cassette
1
Empty tray
Stack height 150mm
4”, 20+
2 sets
Full tray
Stack height 100mm
4”, 15+
6 sets
Tape type
Blue tape
UV tape
Vacuum cup
Auto height alignment
電子型錄.pdf