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  3. Die Sorting System（HDS-200）

Die Sorting System（HDS-200）

HDS-200

 

 

Features：

  • Support 8”/12” Frame wafer

  • Output waffle tray 2”/3”/4”tray

  • Output 6 bins maximum

  • HDS-200 running cycle time≦0.56s

  • HDS-200 UPH≧ 6K

  • Tray P/N confirm

  • Backside inspection(Option)

  • P&Pclean platform

  • Easy change kit

  • Dimension1.5m(W) x 1.5m(L) x 2m(H)

  • Clean room class 100 (HEPA)

Vision inspection：

  • Surface and sawing lane

    • foreign material/ chiping

    • scratch / crack

  • Resolution

    • 15μm / NG size; 1 pixel = 3μm


Basic Functions：

  • Wafer auto loading/unloading

  • Wafer tape expending（10 mm Maximum）

  • Mapping data confirm

  • Die transportation

  • 8”/12” wafer switch

  • Die backside inspection（Option）

  • Outputtray In-pocket inspection

  • Output tray 2x3

  • Tray stack 2x3

  • Empty tray auto load

  • Ionizer

  • HEPA


Specification

UPH6.0K ±10% (No backside inspection)
Cycle time0.56 sec(maximum)
Wafer size8”, 12”
Walffle Tray size2”, 3”, 4”
Category/bins6 (=2x3)
Die size range1x1 ~ 35x18 mm
Place accuracy±40μm
Backside resolution15μm / NG size
Vacuum cup change time< 3 min
Needle change time< 5 min
Wafer cassette1
Empty trayStack height 150mm
4”, 20+
2 sets
Full trayStack height 100mm
4”, 15+
6 sets
Tape typeBlue tape
UV tape
Vacuum cupAuto height alignment
   
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