Chaozhou Three-Circle (Group) Co., Ltd. (CCTC) was established in 1970. It is a comprehensive enterprise engaged in research and development, manufacturing and sales of electronic basic materials, electronic components and communication devices. The company's products cover optical communications, electronics, electrical, machinery, energy conservation and environmental protection, new energy, biological and fashion applications. 

The main products are electronic components, semiconductor components, information and communication components and new energy components and system integration. Within these industries the sales volume of ceramic substrate for chip resistor and ceramic rod for resistor are one of the market leaders in the world.
 

CCTC Ceramic Capillary 三環瓷嘴

Thermosonic and ultrasonic bonding is widely used in semiconductor packaging like IC、LED and discrete devices. Capillary is one of the key tools to finish wire bonding.
CCTC: expert in ceramic materials. Its capillary is made from high-density materials. Through fine and uniform processing, the high precision and high stability of CCTC capillary is ensured. This process guarantees the quality of the products. In addition, CCTC enjoys design, analytical capabilities and engineering technical support. All customers’ technical problems can, thus, be addressed with great efficiency.

現今IC、LED、分立器件等半導體封裝行業，大部分是採用超聲波熱壓銲來實現封裝的銲線製程，而在銲接過程中，瓷嘴就是其完成引線銲接的核心部件之一。
三環瓷嘴是以耐久性的材料為基礎，通過高精度且均一的加工技術，保障產品的質量。另外，通過設計、解析能力以及工程技術支持，可以最大程度地解決客戶的技術問題。

Material Properties 材料特性

CCTC produces two series of ceramic capillaries - - AZ series and AC series. Both are made from high density materials, improving wear resistance and reducing tip abrasion. With integrated production mode and high quality inspection system, CCTC capillaries exhibit excellent performance in a variety of packaging designs and bonding wires, such as gold wire, alloy wire and copper wire.

三環的長壽命材料 - - AZ系列(鋯晶)、AC系列(鋯鑽)，主要採用了緻密性高的材料，從而提高產品的耐磨性能，可以抑制瓷嘴的尖端磨耗現象，滿足對銲接要求更高的應用。一體化的生產模式和高標準的質量檢測體系使得CCTC瓷嘴在各種IC、LED、分立器件封裝形式中都顯示出卓越的性能，適用於金線、合金線、銅線。
 

AZ和AC系列的物理和機械性能
Physical and Mechanical Properties of AZ and AC Series

Items	AZ	AC
顏色 Color	White	Pink
硬度 Hardness(HV1)	1950	1980
晶粒大小 Grain size(µm)	0.74	0.77
密度 Density(g/cm³)	4.160	4.213
成分 Composition	Al₂O₃+ZrO₂	Al₂O₃+ZrO₂+Cr₂O₃

 

AC系列 AC Series

AZ系列 AZ Series

Tip Surface Finishes 瓷嘴尖端表面處理

In recent years, new semiconductor interconnect technologies are rapidly emerging, leading to intense market competition. Packaging companies make every effort to lower their costs. Such changes include changes in lead frame, substrate materials, metal coating of bonding area, wire types, wire diameters and the bonding process. These changes may, therefore, affect the reliability of wire bonding.
To provide effective solutions for the above changes, CCTC has developed and manufactured capillaries with various kinds of tip surface finish, further improving wire bonding reliability for customers.

近幾年來新的封裝技術不斷湧現，各個行業的競爭加劇，各個企業通過各種途徑降低製作成本，從金屬框架、基板材料、銲區的金屬鍍層、線材、線徑以及銲線工藝都做了很大的變化，加大了銲線工藝的難度，而影響了銲線的可靠性。
針對這種變化，CCTC研發了相對應的各種的表面處理新工藝，來進一步提高銲線工藝的可靠性。
 

	P系列 P Series P系列適用於金線應用，表面拋光處理會降低銲線過程中瓷嘴尖端的殘留物有效提高瓷嘴的長度。 P series：polish treatment,which are designed for gold wire application,could reduce intermetallic build-up on the tip,effectively longer the tool life.
	M1系列 M1 Series M1系列適用於金線或銀合金線的應用，在第二焊點可焊性較差的應用條件下，提高金線或合金線的銲線質量和可靠性。 M1 series：for gold wire or Ag alloy wire application ,esp.,to improve bonding quality and reliability in poor solderability of the 2nd bond area application conditions.
	M2系列 M2 Series M2表面處理是針對對合金線銲線應用所設計的在表面採用形成一個微觀上的顆粒狀處理，有效加強劈刀與銲線的咬合程度，提高第二焊點的可靠性。 M2 series：for alloy wire application. Micro grain surface on the tip, excellent in enhancing better coupling between the capillary and the wire, to improve reliability of the stitch bond.
	M3系列 M3 Series M3適用於銅線的應用，在表面採用特殊的顆粒狀處理，加強劈刀的抓線能力，提高第二焊點的可靠性。 M3 series：for Cu wire application. With special granulated morphology surface finishes, this series have better gripping ability, which are tailored to improve the tail bond reliability.
	M4系列 M4 Series M4是針對銅線可焊性較差的應用條件而研發出的，有效的提高銲線二焊點的質量；並且這種宏觀上的粗糙是可控的，可根據客戶的使用條件設計。 M4 series：for Cu wire application with poor bonding conditions, effectively improving the stitch bond quality. What's more, the tip surface grain size could be changed and custom designed.

 

	Company website:
	http://www.cctc.cc/default.aspx