SBS-300+

Features：

• Semi-auto Wafer inspection after sawing

• Easy to operate by Chinese/English HMI

• Auto Load/Unload Port

• Auto wafer position alignment

• Auto wafer transportation

• Auto X-Y stage for wafer inspection

• Wafer are selectable in cassette

• Sawing Lane running path selected

• For both 8” & 12” wafer

• High Magnification Camera

Inspection stage

Transportation

General specification：

Wafer type
8” & 12” wafer with frame

Wafer Cassette Load/Unload port
8” and 12” wafer cassette
Wafer protection

Work-holder station
Programmable X-Y-θ table

Inspection system
High Magnification Camera module

Operation interface (HMI)
Chinese/English switch
Wafer set up
Joystick function