Chengdu ZongLen Technologies Co., Ltd., headquartered in Chengdu, China, is a professional enterprise specializing in high- and low-temperature intelligent equipment for the pan-semiconductor industry. The company operates through refrigeration and semiconductor divisions. Zonglen primarily produces ultra-low-temperature refrigerators, Temperature Forcing Systems (Thermo TST), benchtop boxes, and temperature shock boxes for applications including wafers, chips, optical communications, and automotive electronics.
Zonglen has provided products and services to over 15 countries worldwide and maintains service outlets across China.
ThermoTST ATC
| The ThermoTST ATC series adjusts the temperature of the DUT to the target temperature point for performance testing through direct contact between the contact head and the DUT. Suitable for both soldered chips and chips using sockets, it can truly control the temperature of the tested chip without affecting the peripheral circuit, eliminating uncertainty caused by peripheral circuits. |  |
Test standard
- Meet the U.S. military standard MIL system test standards.
- Meet JEDEC test requirements.
- Temperature range of -70°C to +200°C
ThermoTST
| ThermoTST is a sophisticated cryogenic deviceimpact airflow meter, with a wider temperature range, providing very advanced temperatures transformation test capability. After long-term and multi-working condition verification, meet all kinds of production environment and engineering environmental requirements. ThermoTST is pure mechanical refrigeration, noneliquid nitrogen or any other expendable refrigerant required. |  |
Features
- Temperature change rate is fast
- Temperature range of -90°C to +225°C
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ±1°C, display accuracy ±0.1°C
- Defrosting design, rapid removal of internal wafer vapor accumulation