Dynatech has succeeded in developing Wafer mount/detape system linked with B/G machine in order to accommodate edge semiconductor packaging process which gradually has tends to become slim, compact, high integrated and high functions. This will convince us to expand our position in domestic and overseas market by obtaining a good reputation from customers as well as import substitution effect.


Product introduction


FANOUT Process; Fully-auto metal carrier laminator & de-taper (DT-CLR2030) 


FANOUT Process; Fully-auto de-bonding system (DT-WDB2050A)


Fully Auto Wafer Mounter Fully Auto Tape Lamination Fully Automatic U.V Irradiation


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