Hypersonic Inc. is pleased to announce its participation in SEMICON Taiwan 2025, taking place from September 10 to 12, where it will showcase its latest semiconductor packaging and testing equipment, automation solutions, and cutting-edge material applications. The company will also engage in in-depth discussions with global semiconductor partners to explore new opportunities for collaboration.

This prestigious event gathers top-tier enterprises and professionals across the global semiconductor supply chain. Under the theme “Smart Manufacturing × Sustainable Innovation,” Hypersonic will present newly introduced technologies, covering areas such as advanced packaging & testing, automation integration, thermal management, and high-reliability materials—empowering customers to enhance production efficiency and product quality.

“SEMICON Taiwan is a key platform for us to strengthen our brand presence and global connections. We look forward to exchanging insights with our industry partners and jointly driving the next wave of semiconductor innovation and sustainable transformation.”

You are warmly invited to visit us at Booth N0776, 4F, TaiNEX 1, Nangang Exhibition Center.
Exhibition Dates: September 10–12, 2025

Join us in discovering the future of semiconductor technology and innovation!


 

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