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Wafer skeleton inspection(WS-100)
WS-100
Features:
Auto load wafer
Wafer expansion
Read wafer ID
Load wafer mapping data
Line-scan camera
Skeleton die inspection
Analysis and show result
Mapping rotation is workable
8”←→12” by change kit
Specification
Inspection Module
Vision system
Line-scan camera 16K pixel
Light source
Red light
Wafer Handling
Working type
Wafer with frame
Wafer size capability
8”; 12”
Load port
Single 8” ,12” Framed-wafer cassette
Handling
Gripper / Rail
System Dimension
Dimensions (L x W x H)
1500 mm x 1800 mm x 2000 mm
Wieght
1300 Kg
電子型錄.pdf