瀚轩股份有限公司- Hypersonic Inc Company - IC封装

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产品介绍

MSC

In order to stay highly competitive globally as well as domestically, we have been focusing on developing our products through our own researches and technologies. Our lines include additives, corrosion inhibitors, cleaners, activators and a catalyst as well as eco-friendly products related to electronic components, such as semi-conductor, PCB, and cellular phones. Also focus on wafer base bumping process, we provide MS-AG80 ( SnAg ) and MS-CP70 ( Cu Pillar ) solution and provide high ASD and high quality material to customer.

MSC Overview:

Founded 2005
Historical Basis : Surface-Treatment Chemicals
2 Plants in Korea, and 1 Plant in China
Certified ISO9001, 14001 & OHSAS System
Focusing R&D : 15% in total head counts Class 1,000
Max. capa 7-10 tons per month
Automatically controlling and monitoring in-line process

MS-AG80(SnAg)

Design Concepts

Meet to customer CTQs
- No PR damage & crack during plating process
- Bumping uniformity
- No void or improve void performance compare with competitor
- Bumping quality - no bump missing & no abnormal bump shape
- Ag% Control
  - 1.8-2.3% regardless of ASD
- Reliability (TC, THB, and HTS)
Improvement of ASD to increase of productivity
- 8-16 ASD with adjustment of Ag% composition
Provide TCoO (Total Cost of Ownership) to customer

Comparison Data

_{Beta site apply to apply comparison}

Item		High speed candidate
Model		Competitor A	Competitor B	MS-AG80
PR Leaching	AZ4620	Pass	Pass	Pass
PR Leaching	AZP40XT	Pass	Pass	Pass
Optimized plating rate (ASD)		6um/min (12)	4um/min (8)	6um/min (12)
Uniformity after reflow (WID, <5%)		Max. 4.64	Max. 4.72	Max. 1.7
Uniformity after reflow (WIW, <10%)		Max. 7.98	Max. 14.1	Max. 4.38
Ag composition (Max %)		3.11	3.9	1.9
Bump surface after reflow		Good	Wrinkle	Good
Make-up cost ($ / L)		High	High	Low
Material Cost ($ / wafer)		High	High	Low
Process Cost ($ / wafer)		Middle	High	Low

►MS-AG80 showed a better position in terms of material quality and cost

MS-CP70 ( Cu Pillar )

Design Concepts

High deposition rate, more than 10 ASD (range 4-22 ASD)
Minimize or eliminate micro void during plating process
Using the purified raw materials to meet an excellent uniformity and RoHS requirement
Meet to customer CTQs
- WID <5%
- WIW <10%
- Void free interface b/w Solder and Cu Pillar
Cost attractiveness

Plating Simulation with TSV

Solution	TSV Type	Machine
Base : 280mL Suppressor :10mL Leveler :2mL Accelerator :10mL

10ASD

12ASD

14ASD

16ASD

18ASD

►No issue Cu plating at 10-18 ASD

Application for process

« Bumping »

« Cu Pillar »


Pb-Free Bump		Cu Pillar & u-Pillar
Diameter	75-150um	Diameter	20-100um
Product	MS-AG80 (High ASD Version) MS-AG40 (Low ASD Version)	Product	MS-AG80(SnAg) MS-CP70(Cu)

	Company website:
	http://www.mschemical.co.kr/